Features

This system is for packaging IC packages in a embossed tape. It picks up diced IC packages (CSP/WL-CSP) from a dicing tape, does some testing such as checking of appearance and marks of IC packages, and packages them in a embossed tape.

• Reliable alignment guide mechanism.
• Image testing
• 2D checking (Appearance, chipping, scratch, position and size of solder dross, etc.)