Taping System (TSM-X TRH Series)
Reliable system with alignment guide mechanism that is a main feature of.
Specifications
| Package | CSP, WL-CSP |
| Package size | 0.6mm to 6.0mm |
| Takt time | 0.5 to 0.9sec./pc |
| Wafer size | 5 to 8 inch |
| Dimensions | TSM-X: 1340W x 1315D x 1800H mm TRH: 1850W x 1220D x 1750H mm |
| Width of tape | Wafer magazine (25) |
| Option | Barcodes for countermeasure against static electricity / Control by lot / Detaping / Spiral reel |
