Features

This system is for marking on wafers; silicon wafer, sapphire substrate, and compound wafer.

• Small footprint.
• Highly precise marking.
• High throughput.

[White marking: by SHG laser]
It melts only surface of a silicon wafer, so marking can be done without particles.

[Black marking: by fundamental laser]
It engraves surface of a silicon wafer. Marked workpiece has a high level of visibility and can be read clearly even after cleansing and grinding.