Features

This system performs the scribing of patterns on various substrates: transparent electrodes (ITO or FTO) or metal electrodes used for flat panel displays, including touch screens, and photovoltaic cells of amorphous silicon (a-Si), metal compounds (CIGS), dye-sensitized types, or organic thin films; and energy conversion layers (a-Si) of photovoltaic cells. Combining our "top hat beam" technology, which was created by means of our unique special optics technologies, and our automated machine technologies, this system is equipped with a positioning function that uses image processing technology in order to provide uniform and ultra-precise scribing.

By using the reliable fiber delivery method, it enables the scribing of substrates with a maximum size of 1200 mm - 1600 mm to be performed at a fast speed of up to 2 m/s, greatly contributing to improving production efficiency by reducing takt times.

This system is best suited to P1-P3 processes, as it is equipped with fundamental mode (1064 nm) lasers for the P1 process and SHG (532 nm) lasers for the P2 or P3 process.

* We offer solutions or machine designs that are ideally suited to your processing priorities.

• This system's special rectangular top hat beams provide smooth scribing lines.
  - Its beam intensity distribution ensures uniform scribing.
  - Its low overlap ratios ensure fast, high-quality scribing.
  - It ensures stable scribing as its beam distribution is little affected by out-of-focus displacements.
• It is equipped with our own proprietary high-quality laser oscillators designed especially for thin-film processing.
• It is equipped with high power laser oscillators: 40 W max. for the P1 process and 30 W max. for the P2 or P3 process.
• Its combination with variable attenuators enables high-accuracy beam branching to be achieved.
• The fiber delivery method is used.
• As the laser oscillators are completely separated from the processing units, it provides reduced vibrations, improved dust protection, and enhanced maintenance.
• By employing compact design processing units, it can handle up to eight simultaneous processing lines (high throughput).