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Laser Welders

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Fine Spot Welders
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MIYACHI's Technology

System

Laser Wafer Marking System Thin Film Laser Scribing Machine CSP Marker System Laser Titler (Inner Glass Marking type)  Laser Titler (Coat Removal type)  Photovoltaic Cell Laser Scribing Machine Motor Fusing System

Miyachi’s systems are filled with expertise in both welding and processing technologies Miyachi has cultivated. Miyachi designs not only the systems with Miyachi’s laser welders, Laser markers or resistance welders but also the system combining these machines to offer more upscale systems.

Inquiry Quotation Manufacturing Receipt Service after sales

Laser Wafer Marking System

 

High quality soft / hard marking by selecting the appropriate laser type from YAG fundamental laser or YAG SHG laser.

Demo unit is available at Kita-Kanto AP Lab.

Our experienced staffs test your sample! Please feel free to request.


 

This is the system for marking letters and 2D codes on silicon wafers.

 

・Soft marking by YAG SHG laser marker:

It melts only surface of a wafer to mark so that debris is not produced.

 

・Hard Marking by YAG fundamental laser marker:

It engraves surface of a wafer to mark and creates vivid contrast.

The marking result is recognizable even after cleansing or grinding.

  • Small footprint
  • High precision marking
  • High throughput

 

【Soft Marking】 【Hard Marking】

          

φ70μm,　2.5μm deep φ60μm,　100μm deep

 

【Internal View】 【Operation Screen】

　　

※Click to show larger view.

Specification Wafer size 12 inch (2 FOUP) *Also available in 6 and 8 inch
Marking performance [Soft marking]
Dot diameter: φ70μm、 Dot depth: 2.5μm
[Hard marking]
Dot diameter: φ60μm、 Dot depth: 100μm (max.)
Marking precision ± 200μｍ （Option ±75μm）
Throughput 150WPH (5×9、12 letters)
Dimension and weight 1400（W）×2033（D）×2000（H）mm、1200kg

Thin Film Laser Scribing Machine

 

High speed and high quality laser scribing of thin films.

Demo unit is available at System Lab in Osaka.

Our experienced staffs test your sample! Please feel free to request.


 

Thin Film Laser Scribing Machine is used mainly for TFPV; thin-film photovoltaic, for which demand has been increasing recently due to the increase of interests in environmental protection. This machine performs one of the TFPV manufacturing process called “Edge deletion” by which a layer at four sides of TFPV is removed to insulate. This machine enables high quality edge deletion at high speed.

Thin Film Laser Scribing Machine is also able to be used for processing of ITO films in touch panels.

  • Remove a layer at four sides of TFPV to insulate.
  • Uniform width of scribing line due to square-shaped laser beam.
  • Maximum processing speed: 1,500mm2/s

 

【Scribing Image】

 

Specification Laser YAG (1,064nm), 200W max.
Beam size 600μm max.

CSP Marker System

 

This system is for marking ID letters on CSP (Chip size package).

  • SHG laser reduces the possibility of damage to the circuits.
  • High precision scanning head enables high speed motionless marking on 8 inch wafers.
  • Possible to mark even on warped wafers.
  • The system that operates for each chip piece by piece can be customized.
 
Specification Wafer size 8 & 12 inch or 6 & 8 inch
Marking type Black marking, White marking
Marking precision ±20 - 250μｍ (Depend on marking area)
Takt time 6 min. (In case of marking on 1000 chips divided by 9)
Dimensions 1825（W）×1085（D）×1230（H）mm （8 / 12 inch type）

Laser Titler (Inner Glass Marking type)

　

This system is for marking ID as letters and 2D codes on flat panels by producing micro cracks inside of glasses of panels.

  • Possible to confirm the readability of the ID right after marking is completed.
  • High throughput by multi heads.
  • Marking without debris.
 
Specification Substrate size Up to the eighth generation (Thickness: 0.6mm or thicker)
Takt time 50s （G8、4 pcs、2 heads）
Marking precision 200μｍ
Transport system Conveyor or robot
Dimension 2800（W）×11000（D）×2500（H）mm （The eighth generation）

Laser Titler (Coat Removal type)

 

This system is for marking ID as letters and 2D codes after removing thin evaporated films on glasses.

  • High throughput by multi heads.
  • Fast and precise alignment is achieved by built-in camera.
  • Possible to mark on the inside of layered substrates without laser being refracted.
 
Specification Substrate size Up to the eighth generation (Thickness: 0.4×1〜1.1×2mm）
Takt time 200s （G8、30 pcs、2 heads）
Marking precision 80μｍ
Transport system Conveyor or robot
Dimension 3000（W）×6500（D）×3000（H）mm (The eighth generation)

Photovoltaic Cell Laser Scribing Machine

　

This machine is for removing thin layers on glasses and film substrates.

  • Attaching the rewind unit, it can work with reeled film substrates.
  • Combination of high precision scanner and stage improves both precision and takt time.
 
Specification Substrate Glass or film
Laser Fundamental, SHG, THG
Marking precision 30μｍ
Transport system Robot or reel unit
Dimension 3000（Ｗ）×1400（Ｄ）×2250（Ｈ）mm

Motor Fusing System

　

This system automatically handles a series of fusing process in motor production.

  • Complete automation of all process from loading to removing the products.
  • Stable fusing by controlling force and penetration rate.
  • Possible to save each welding schedule of current, voltage, weld time, force and penetration rate by segments.
 
Specification Motor Diameter of core must be larger than ø30mm.
Takt 78ｓ (In case of 30 segments)
Transport system Robot
Dimension 1000（Ｗ）×700（Ｄ）×1600（Ｈ）mm
※These systems are just a few of examples. Miyachi offers the system fit your applications.
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